• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    an innovative passive cooling solution with a sealed uav enclosure system allows heat from a semiconductor chip to be dissipated into the environment through evaporative / condensing phase change cooling and air cooling from a heat sink like a fin ( 140) without additional power consumption to operate the cooling solution. An example of such a solution may include a tube (105) with a fin and a fluid. the tube may include a wick structure (150) along an inner surface of the tube configured to allow fluid to displace the wick structure and allow a vapor to form from the fluid to exit the wick structure toward a center from the tube.
    公开号:BR112019011977A2
    申请号:R112019011977-9
    申请日:2017-12-01
    公开日:2019-11-05
    发明作者:Andrew Chiu Chinchuan；Le Don；Anderson Jon；Wang Peng
    申请人:Qualcomm Inc；
    IPC主号:
    专利说明:

    SYSTEMS, METHODS AND APPARATUS FOR PASSIVE COOLING OF
    UAVS
    FIELD OF REVELATION [0001] The present revelation refers in general
    to air vehicles no manned (UAVs) and more specifically, however no exclusively, cooling passive for UAVs. BACKGROUND [0002] Systems Small UAVs (at times
    referred to as drones) generate a lot of heat from the CPU, GPU, DDR, WiFi, GPS, PMIC, Video / ISP and Camera Sensor components. This heat presents a significant thermal control challenge to achieve safe UAV operations in harsh environments because the wing junction temperature, high ambient temperature (40 2 C) and radiation from the sun become major thermal barriers to achieve high performance. In addition, skin temperature is also a design limitation as most UAV manufacturers request 45 -55 2 C as the maximum temperature
    allowable surface area tap to to allow what the users hold the UAV for to view previously at camera images, for example. [0003] 0 control thermal of systems in UAV
    need to address both junction and surface temperatures. Currently, UAV manufacturers integrate a mini-fan to control chip junction temperature and enclosure surface temperature. However, fan cooling solutions add a serious vulnerability to the entire UAV system: after the fan fails, the fans overheat.
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    2/21 major components would cause the UAV to stop or lead to permanent electrical or thermomechanical failure.
    [0004] In addition to the problems of reliability, cost, space, weight, noise, maintenance, additional energy consumption to operate a fan, as well as moisture, dust and other contaminants that can damage sensitive electronic components inside the UAV are some of the additional concerns when a fan cooling solution is applied.
    [0005] Therefore, there is a need for systems, apparatus and methods that overcome the deficiencies of conventional approaches including the methods, system and apparatus provided by this.
    SUMMARY [0006] The following presents a simplified summary referring to one or more aspects and / or examples associated with the apparatus and methods revealed here. As such, the following summary should not be considered an extensive overview referring to all aspects and / or examples considered, nor should the following summary be considered to identify key or critical elements referring to all aspects and / or examples considered or outline the scope associated with any specific aspect and / or example. Therefore, the following summary has the sole purpose of presenting certain concepts referring to one or more aspects and / or examples referring to the apparatus and methods revealed here in a simplified form to precede the detailed description presented below.
    [0007] In one aspect, an appliance
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    3/21 passive cooling comprises: a tube with a fin and a fluid, the fin located at the top of the tube at a first location, a heat source attached to the top of the tube at a second location, the space at the second location at a first distance from the first location; a propeller located above the fin; and a wick structure along an inner surface of the tube, the wick structure configured to allow the fluid to travel in the
    structure wick and to allow what a steam graduate of fluid to get out of structure wick in direction to one center of pipe. [0008] In other aspect, one device in
    passive cooling comprises: heat transfer medium, the heat transfer medium configured to transfer heat from a second location to a first location spaced a first distance from the second location; heat dissipating means, the heat dissipating means located at the top of the heat transfer medium at the first location; heat conduction means, the heat conduction means located in the heat transfer medium; air flow medium, the air flow medium located above the heat dissipation medium; and liquid containment medium along an internal surface of the heat transfer medium, the liquid containment means configured to allow the heat conduction medium to move in the liquid containment medium and allow a vapor to form from the heat conduction medium to exit the medium for containing liquid towards a center of the medium for heat transfer.
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    4/21 [0009] In yet another aspect, a UAV comprises: a body; a tube with a fin and a fluid, the fin located on top of the tube at a first location outside the body and the tube extends from the inside of the body to the outside of the body; a heat source fixed to the top of the tube at a second location inside the body; the space of the second location at a first distance from the first location; a propeller located above the fin; and a wick structure along an inner surface of the tube, the wick structure configured to allow fluid to travel in the wick structure and allow a vapor to form from the fluid to exit the wick structure towards a center of the pipe.
    [00010] Other features and advantages associated with the apparatus and methods disclosed here will be evident to those skilled in the art based on the attached drawings and detailed description.
    BRIEF DESCRIPTION OF THE DRAWINGS [00011] A more complete recognition of aspects of the disclosure and many of the inherent advantages of the disclosure will be readily obtained as it becomes better understood by reference to the following detailed description when considered with respect to the attached drawings that are presented exclusively for illustration and not limitation of the disclosure, and in which:
    [00012] Figure 1 illustrates an example of a tube for passive cooling according to some examples of the development;
    [00013] Figure 2 illustrates an example of a UAV with a passive cooling tube according to some
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    5/21 examples of the revelation;
    [00014] Figure 3 illustrates an example of a UAV with four propellers and a plurality of tubes for passive cooling according to some examples of the disclosure;
    [00015] Figure 4 illustrates an example of a UAV with four propellers and two straight tubes for passive cooling according to some examples of the revelation;
    [00016] Figure 5 illustrates an example of a UAV with four propellers and an H-shaped tube for passive cooling according to some examples of the disclosure;
    [00017] Figure 6 illustrates an example of a UAV with four propellers, two L-shaped tubes not connected, and two L-shaped tubes connected for passive cooling according to some examples of the revelation; and [00018] Figure 7 illustrates an example of a UAV with a tube for passive cooling according to some examples of the disclosure.
    [00019] Figures 8A-G illustrate examples of heat dissipation configurations according to some examples of the disclosure.
    [00020] According to common practice, the characteristics shown by the drawings may not be drawn to scale. Therefore, the dimensions of the features shown can be arbitrarily expanded or reduced for clarity. According to common practice, some of the drawings are simplified for clarity. In this way, the drawings may not show all
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    6/21 components of a specific device or method. In addition, similar reference numerals indicate similar characteristics from beginning to end of the specification and figures.
    DETAILED DESCRIPTION [00021] The methods, apparatus and exemplifying systems disclosed here alleviate disadvantages of conventional methods, apparatus and systems, as well as other needs not previously identified. Some examples in this disclosure provide an innovative passive cooling solution with a sealed UAV housing system that is lightweight and allows heat to be dissipated from a semiconductor chip to the environment very efficiently without fan cooling while enabling an airtight cooling structure. UAV to maximize system reliability and protect electronic media from moisture, dust and corrosive chemicals. An example includes a tube with a fin located on a top of the tube outside the UAV casing under a propeller, a fluid inside the tube and a wick structure along an inner surface of the tube. The wick structure configured to allow the fluid to travel in the wick structure from a heat source within the UAV housing where a form of fluid vapor is generated by heat from the heat source and exits the heat structure. wick towards a center of the tube. The steam then travels in the center of the tube to the fin where the wing helps to extract heat and cause the steam to condense back into liquid inside the wick structure.
    [00022] Figure 1 illustrates an example of a
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    7/21 tube for passive cooling according to some examples of the development. As shown in figure 1, a passive cooling device 105 can include a tube 105, a heat source 110 (for example, a semiconductor matrix, a memory chip, a battery, etc.) located at a second location that transfers heat 111 for tube 105, a heatsink 140 (for example, a bar-shaped fin, a pin fin, or a plurality of bar or pin-shaped fins, etc.) located in a first location that removes heat 111 from tube 105, a wick structure 150 along an inner surface of tube 105, and a fluid 120 within wick structure 150. Passive cooling apparatus 100 can be seen to have three sections - one section of evaporator 160 near heat source 110, a condenser section 170 near heat sink 140 and an adiabatic section 180 between evaporator section 160 and condenser section 170. In evaporator section 160, fluid 120 is converted in a steam 13 0 and exits the wick structure to the center of the tube 105. In the adiabatic section 180, the steam 130 moves towards the condenser section 170 in the center of the tube due to the adiabatic expansion that occurs in the evaporator section 160 while the liquid 120 moves towards the evaporator section 160 in the wick structure 150. In the condenser section 170, the steam 130 is converted back into a liquid 120 and moves into the wick structure 150.
    [00023] Tube 105 can be approximately 2-4 mm in width and have a round, oval, square or rectangular circumference, for example. Tube 105 can be a
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    8/21 straight tube, an L-shaped tube, an H-shaped tube, or a T-shaped tube, for example. The tube 105 can have an extremely high thermal conductivity of 10k W / mK, for example. Tube 105 can be composed of aluminum, copper, plastic materials or a combination of these materials depending on the desired trade-off between weight and cooling performance. The thickness of the tube 105 can be varied along the axial direction of the tube 105 with some thicker portions and some thinner portions to accommodate available space within the UAV and different chip set heights. The thickness of the heat pipe can vary from 0.5 mm to 5 mm. The wick structure 150 can be a honeycomb, mesh, fiber or microscale wick structure filled with dust that acts as a passive pump allowing steam to escape from the wick structure 150 and allowing liquid to enter the wick structure 150 as well how to move from the first section to the second section in an adiabatic process. Heatsink 140 may be a pin fin or plurality of pin fins, a bar-shaped fin or a plurality of bar-shaped fins, or similar shapes that remove heat from tube 105 for dissipation out of tube 105 The heatsink 140 can be composed of aluminum, copper, plastic materials, or a combination of these materials depending on the desired trade-off between weight and cooling performance. The heat source 110 can be a semiconductor chip, a logic chip, a memory chip, a battery, or a similar device that produces ill heat. Heat source 110 can be attached directly to tube 105 to allow heat 111
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    9/21 transfer from heat source 110 to tube 105 or it can be fixed with a thermally conductive adhesive.
    [00024] Figure 2 illustrates an example of a UAV with a tube for passive cooling according to some examples of the revelation. As shown in figure 2, a passive UAV cooling device 200 may include a tube 205 (e.g., tube 105), a semiconductor chip 210 mounted on tube 205 in a second location, a first plurality of fins 240 mounted on tube 205 at a first location, and a second plurality of fins 242 mounted on tube 205 at a third location. Tube 205 allows heat 211 from semiconductor chip 210 to travel in tube 205 from the second location to both the first plurality of fins 240 at the first location and the second plurality of fins 242 at the third location. The passive UAV cooling apparatus 200 may include a first propeller 220 located above the first plurality of fins 240, a second propeller 222 located above the second plurality of fins 242. The first plurality of fins 220 and the second plurality of fins 222 can providing forced convective cooling air 221 in the first plurality of fans 240 and the second plurality of fans 242 respectively to dissipate heat from the heat pipe to ambient air with a volume air flow of approximately 45 CFM. The passive UAV cooling apparatus 200 may include a lance 230 extending to either side of a body housing 260 that houses a printed circuit board 250 attached to the semiconductor chip 210 opposite tube 205.
    [00025] The body shell 260 can be
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    10/21 plastic or aluminum, for example, and can be hermetically sealed to protect printed circuit board 250 and semiconductor chip 210 from moisture, dust and corrosive chemicals. The lance 230 can be of plastic or aluminum, for example, and supports the portion of the tube 205 extending outside the body casing 260 as well as the first propeller 220 and the second propeller 222.
    [00026] Figure 3 illustrates an example of a UAV with four propellers and a plurality of tubes for passive cooling according to some examples of the revelation. As shown in figure 3, a UAV 300 (for example, UAV 200) can include a tube 305 (a tube 105 or tube 205), a first plurality of fins 340 mounted on tube 305 in a first location, a second plurality of areas 342 mounted on tube 305 at a second location, a third plurality of fins 344 mounted on tube 305 at a third location, and a fourth plurality of fins 346 mounted on tube 305 at a fourth location. The UAV 300 can include a 360 housing, a camera 335 mounted in front of the 360 housing and a battery 365 mounted on top of the 360 housing. The UAV 300 can include a first propeller 320 mounted on a first 330 boom above the first plurality of fins 340, a second propeller 322 mounted on a second boom 332 above the second plurality of fins 342, a third propeller 324 mounted on a third boom 334 above the third plurality of fins 344 and a fourth propeller 326 mounted on a fourth launches 336 above the fourth plurality of fins 346.
    [00027] Although four propellers (for example,
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    11/21 propeller 220 or propeller 222) are shown in figure 3, it should be understood that a greater or lesser number of propellers can be used. Although four lances (for example, 230 lance) are shown in figure 3, it should be understood that a greater or lesser number of lances can be used depending on the number of propellers or plurality of fins. Although four separate fins pluralities (for example, first plurality of fins 240 or second plurality of fins 242) are shown in Figure 3, it should be understood that a greater or lesser number of pluralities may be used and each plurality of fins may include a or more fins. Although a single heat pipe 305 is illustrated in Figure 3, it should be understood that one or more separate heat pipes can be used.
    [00028] Figure 4 illustrates an example of a UAV with four propellers and two straight tubes for passive cooling according to some examples of the revelation. As shown in figure 4, a UAV 400 (for example, UAV 300) can include a first tube 405 (for example, tube 305), a second tube 406 (for example, tube 305), a housing 460, a camera 435 mounted in front of the body housing 460, and a printed circuit board 450 in the body housing 460. The UAV 400 may include a first propeller 420 mounted at one end of the first tube 405, a second propeller 422 mounted at an opposite end of the first tube 405, a third helix 424 mounted at one end of the second tube 406 and a fourth helix 426 mounted at an opposite end of the second tube 406. The UAV 400 may include a first semiconductor chip 410 (for example, heat source 110 ) mounted on the first tube 405,
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    12/21 a second semiconductor chip 412 (eg, heat source 110) mounted on the first tube 405, a third semiconductor chip 414 (eg, heat source) mounted on the second tube 406, and a fourth semiconductor chip 416 (eg example, heat source 110) mounted on the second tube 406. Although four chips are illustrated in figure 4, a greater or lesser number of chips can be used and the distribution between the first tube 405 and the second tube 406 may not be the same. Although the first tube 405 and the second tube 406 are illustrated as straight rectangular tubes, other shapes can be used as oval, curved, for example, and the tubes can be physically and or fluidly connected.
    [00029] Figure 5 illustrates an example of a UAV with four propellers and an H-shaped tube for passive cooling according to some examples of the revelation. As shown in figure 5, a UAV 500 (for example, UAV 400) can include a tube 505 (for example, tube 405), a housing 560, a camera 535 mounted in front of the housing 560, and a panel circuit board 550 in the housing 560. The UAV 500 may include a first propeller 520 mounted on one end of tube 505, a second propeller 522 mounted on a second end of tube 505, a third propeller 524 mounted on a third end of tube 505, and a fourth helix 526 mounted on a fourth end of tube 505. The UAV 500 may include a first semiconductor chip 510 (for example, heat source 110) mounted on tube 505, a second semiconductor chip 512 (for example, heat source 110) mounted on tube 505, and a third semiconductor chip 514 (eg heat source 110) mounted
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    13/21 on tube 505. Although three chips are illustrated in figure 5, a greater or lesser number of chips can be used and the locations may not be just along the central portion of tube 405. Although tube 505 is illustrated as a rectangular tube in the shape of H, other shapes can be used as oval, curved, for example, and the tube can be physically and or fluidly connected.
    [00030] Figure 6 illustrates an example of a UAV with four propellers, two unconnected L-shaped tubes and two connected L-shaped tubes for passive cooling according to some examples of the revelation. As shown in figure 6, a UAV 600 (for example, UAV 500) can include a first tube 605 (for example, tube 305), a second tube 606 (for example, tube 305), a third tube 607, a body 660, a camera 635 mounted in front of body housing 660, and a printed circuit board 650 in body housing 660. UAV 600 may include a first propeller 620 mounted on one end of first tube 605, a second propeller 622 mounted at one end of the second tube 606, a third helix 624 mounted at one end of the third tube 607, and a fourth helix 626 mounted at an opposite end from the third tube 607. The UAV 600 may include a first semiconductor chip 610 (for example , heat source 110) mounted on the first tube 605, a second semiconductor chip 612 (eg heat source 110) mounted on the first tube 605, a third semiconductor chip 613 (eg heat source 110) mounted on the second tube 606, a fourth semi chip conductor 614 (for example, heat source 110) mounted on the second tube 606,
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    14/21 a fifth semiconductor chip 615 (for example, heat source 110) mounted on the third tube 607, a sixth semiconductor chip 616 (for example, heat source 110) mounted on the third tube 607, a seventh semiconductor chip 617 (for example, heat source 110) mounted on the third tube 607 and an eighth semiconductor chip 618 (for example, heat source 110) mounted on the third tube 607. Although eight chips are illustrated in figure 6, a greater or lesser number of chips can be used and the distribution between the first tube 605, the second tube 606, and the third tube 607 may not be the same. Although the first tube 605 and the second tube 606 are illustrated as rectangular tubes in the shape of L and the third tube 607, other shapes can be used as oval, curved, for example, and the tubes can be physically and or fluidly connected.
    [00031] Figure 7 illustrates an example of a UAV with a tube for passive cooling according to some examples of the disclosure. As shown in figure 7, a passive UAV cooling device 700 may include heat transfer medium 705 (e.g., tube 105) configured to transfer heat 711 from a second location to a first location and a third location spaced at from the second location, a semiconductor chip 710 mounted in the heat transfer medium 705 in the second location, first heat dissipation medium 740 (eg, heat sink 140) located in a top of the heat transfer medium 705 in the first a second heat dissipating medium 742 (e.g., heat sink 142) located at a top of the heat transfer medium 705 at the third location.
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    15/21 [00032] The heat transfer medium 705 allows heat 711 from the semiconductor chip 710 to travel in the medium for heat transfer 705 from the second location to both the first heat dissipation medium 740 at the first location and the second means for heat dissipation 742 at the third location. The passive UAV cooling apparatus 700 may include a first airflow medium 720 (for example, first propeller 220) located above the first heat dissipation medium 740, a second airflow medium 722 (for example, second propeller 222) located above the second medium for heat dissipation 742. The first medium for air flow 720 and the second medium for air flow 722 can provide forced convective cooling air 721 in the first medium for heat dissipation 740 and second medium for heat dissipation 742 respectively to dissipate heat 711 from the heat transfer medium 705 to ambient air with a volume air flow of approximately 45 CFM. The passive UAV cooling apparatus 700 may include a lance 730 extending to either side of a body shell 760 that houses a printed circuit board 750 attached to the semiconductor chip 710 opposite the heat transfer medium 705.
    [00033] The housing 760 can be plastic or aluminum, for example, and can be hermetically sealed to protect the 750 printed circuit board and the 710 semiconductor chip from moisture, dust and corrosive chemicals. The boom 730 can be made of plastic or aluminum, for example, and supports the heat transfer medium portion 705 extending outside the
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    16/21 housing 760 as well as the first airflow medium 720 and the second airflow medium 722. The UAV 700 may include a heat conduction medium 701 (e.g. liquid 120 and steam 130), the heat conducting means 701 can be located in the heat transfer medium 705 and a means for containing liquid (e.g., wick structure 150) along an internal surface of the heat transfer medium 705, the means for liquid containment can be configured to allow the heat conducting medium 701 to move in the liquid containment medium and allow a form of vapor from the heat conducting medium 701 to exit the medium for containment
    of liquid in direction The a center of middle for transfer in heat 705 How discussed above with reference to figures 1-6, the several components illustrated in figure 7 can be in one number greater or less than what
    shown.
    [00034] Figures 8A-G illustrate examples of heatsink configurations (for example, heatsink 140, 240, 242, 340, 342, 344 or 346, and heat dissipation medium 740 or 742) according to some examples of the revelation. As shown in figure 8A, a configuration can include a plurality of circular heatsinks 140 arranged in rows and columns in line. As shown in figure 8B, a configuration can include a plurality of circular heatsinks 140 arranged in scattered rows and columns. As shown in figure 8C, a configuration can include a plurality of square heatsinks 140 arranged in rows and columns in line. How
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    17/21 shown in figure 8D, a configuration may include a plurality of square heat sinks 140 arranged in scattered rows and columns. As shown in figure 8E, a configuration can include a plurality of plate-like or rectangular heatsinks 140 arranged in scattered rows and columns. As shown in figure 8F, a configuration can include a plurality of oval or elliptical heat sinks 140 arranged in scattered rows and columns. As shown in figure 8G, a configuration can include a plurality of plate-like or rectangular heatsinks 140 arranged in parallel.
    [00035] One or more of the components, processes, characteristics and / or functions illustrated in figures 1-8G can be reorganized and / or combined into a single component, process, characteristic or function or incorporated into several components, processes or functions. Additional elements, components, processes and / or functions can also be added without departing from disclosure. It should also be noted that figures 1-8G and their corresponding description in the present disclosure are not limited to matrices and / or CIs. In some implementations, figures 18G and their corresponding description can be used to manufacture, create, supply and / or produce integrated devices. In some implementations, a device may include a matrix, an integrated device, a matrix package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a device packet to packet (PoP) and / or a means of interposition.
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    18/21 [00036] The word exemplifier is used here to mean serving as an example, instance, or illustration. Any details described here as exemplifiers should not be interpreted as advantageous over other examples. Similarly, the term examples does not mean that all examples include the feature, advantage or mode of operation discussed. In addition, a specific feature and / or structure can be combined with one or more other features and / or structures. In addition, at least a portion of the apparatus described herein can be configured to perform at least a portion of a method described in this way.
    [00037] The terminology used in the present invention is for the purpose of describing specific examples and is not intended to limit examples of the disclosure. As used here, the singular forms one, one and o, are intended to include the various forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprise, comprising, include and / or including when used herein, specify the presence of mentioned features, integers, actions, operations, elements and / or components, but do not exclude the presence or addition of one or more others characteristics, integers, actions, operations, elements, components and / or groups thereof.
    [00038] It should be noted that the terms connected, coupled or any variant thereof, mean any connection or coupling, directly or indirectly, between elements and may include a
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    19/21 presence of an intermediate element between two elements that are connected or coupled together through the intermediate element.
    [00039] Any reference in the present invention to an element using a designation such as first, second, etc. it does not limit the quantity and / or order of those elements. Instead, these designations are used as a convenient method of distinguishing between two or more elements and / or occurrences of an element. Also, unless mentioned otherwise, a set of elements may comprise one or more elements.
    [00040] Nothing mentioned or illustrated in this application is intended to dedicate any component, action, characteristic, benefit, advantage or equivalent to the public, regardless of whether the component, action, characteristic, benefit, advantage or equivalent is mentioned in the claims.
    [00041] Although some aspects have been described in relation to a device, it goes without saying that these aspects also constitute a description of the corresponding method, and so a block one or component of a device must also be understood as a corresponding method action or as a characteristic of a method action. Similarly, aspects described in relation to or as a method action also constitute a description of a block or corresponding detail or characteristic of a corresponding device. Some or all of the method actions can be performed by a hardware device (or using a hardware device), such as a microprocessor, a computer
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    Programmable 20/21 or an electronic circuit. In some examples, some or a plurality of the most important method actions can be performed by such an apparatus.
    [00042] In the detailed description above it can be seen that different characteristics are grouped together in the examples. This mode of disclosure should not be construed as an intention that the claimed examples have more characteristics than are explicitly mentioned in the respective claim. On the contrary, the situation is such that the inventive content can reside in less than all the characteristics of an individual example revealed. Therefore, the following claims should hereinafter be considered to be incorporated into the description, where each claim alone can represent a separate example. While each claim alone may represent a separate example, it should be noted that while a dependent claim may refer in the claims to a specific combination with one or a plurality of claims - other examples may also cover or include a combination of the dependent claim with the subject of any other dependent claims or a combination of any characteristic with other dependent and independent claims. Such combinations are proposed here, unless explicitly stated that a specific combination is not intended. In addition, it is also intended that characteristics of a claim can be included in any other independent claim, even if the claim is not directly dependent on the independent claim.
    [00043] It should also be noted that
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    The methods, systems and apparatus disclosed in the description or in the claims can be implemented by a device comprising means for performing the respective actions of these examples.
    [00044] Although the above disclosure shows illustrative examples of the disclosure, it should be noted that various changes and modifications can be made to the present invention without departing from the scope of the disclosure as defined by the appended claims. The functions and / or actions of the method claims according to the examples of the disclosure described here do not need to be performed in any specific order. In addition, well-known elements will not be described in detail or can be omitted so as not to obscure the relevant details of the aspects and examples revealed here. In addition, although elements of the disclosure may be described or claimed in the singular, the plural is considered unless limitation to the singular is explicitly mentioned.
    权利要求:
    Claims (5)
    [1]
    1. Passive cooling device for an unmanned aerial vehicle, comprising:
    a body;
    a tube comprising a fin and a fluid, the fin located on top of the tube at a first location;
    a heat source attached to the top of the tube in a second location, the second location spaced at a first distance from the first location and the heat source located in the body;
    a propeller located directly above the fin; and a wick structure along an inner surface of the tube, the wick structure configured to allow fluid to travel in the wick structure and allow a vapor to form from the fluid to exit the wick structure towards a center of the pipe.
    [2]
    2. Passive cooling apparatus according to claim 1, in which the wick structure is configured to cause the fluid to evaporate into the tube at the second location and form the vapor which moves towards the first location where the steam condenses back into the fluid.
    3. Apparatus cooling passive, in wake up with claim 2, where the wick structure is one of one honeycomb, mesh, fiber or powder. 4. Apparatus cooling passive, in wake up with claim 1, where the fin is a fin in pin. 5. Apparatus cooling passive, in wake up
    claim 1, wherein the tube is composed of one between
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    2/5 aluminum, copper or plastic materials.
    Passive cooling apparatus according to claim 1, wherein the fin is one of a plurality of circular fins arranged in a line, a plurality of circular fins arranged in a spread formation, a plurality of square fins arranged in line, a plurality of square fins arranged in a spreading formation, a plurality of rectangular fins arranged in a spreading formation, a plurality of oval fins arranged in a spreading formation, or a plurality of rectangular fins arranged in parallel.
    Passive cooling apparatus according to claim 1, wherein the propeller is a plurality of propellers in multiple locations, each spaced from the second location.
    Passive cooling apparatus according to claim 1, wherein the tube is one between a straight tube, an L-shaped tube, an H-shaped tube, or a T-shaped tube and has a thickness between 0.5 mm and 5 mm.
    9. Passive cooling apparatus for an unmanned aerial vehicle, comprising:
    a body;
    heat transfer means, the heat transfer means configured to transfer heat from a second location to a first location spaced at a first distance from the second location;
    a heat source fixed in the middle to transfer heat at the second location;
    means for heat dissipation, the means for
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    [3]
    3/5 heat dissipation located at the top of the medium for heat transfer at the first location;
    heat conduction means, the heat conduction means located in the heat transfer medium;
    middle for flow of air, the medium for flow air located directly above of dissipation medium in heat; and middle for restraint in liquid over an
    internal surface of the heat transfer medium, the liquid containment medium configured to allow the heat conduction medium to travel in the liquid containment medium and allow a vapor to form from the heat conduction medium to exit the medium for containment of liquid towards a middle center to
    heat transfer. 10. Device cooling passive, according with claim 9, in that medium for containment of liquid is configured to do with what O means for
    heat conduction evaporate in the medium for heat transfer at the second location and form the steam that moves towards the first location where the steam condenses back to the medium for heat conduction.
    Passive cooling apparatus according to claim 10, wherein the medium for containing liquid is one between honeycomb, mesh, fiber or powder.
    Passive cooling apparatus according to claim 9, wherein the means for heat dissipation is a pin fin.
    13. Passive cooling apparatus according to claim 9, wherein the means for transferring
    Petition 870190054037, of 6/12/2019, p. 10/50
    [4]
    4/5 heat is made up of one between aluminum, copper or plastic materials.
    Passive cooling apparatus according to claim 9, wherein the means for heat dissipation is one of a plurality of circular fins arranged in line, a plurality of circular fins arranged in a spread formation, a plurality of square fins arranged in line, a plurality of square fins arranged in a scattered formation, a plurality of rectangular fins arranged in a scattered formation, a plurality of oval fins arranged in a scattered formation, or a plurality of rectangular fins arranged in parallel.
    Passive cooling apparatus according to claim 9, wherein the air flow medium is a plurality of propellers in multiple locations, each spaced from the second location.
    A passive cooling apparatus according to claim 9, wherein the heat transfer medium is one between a straight tube, an L-shaped tube, an H-shaped tube, or a T-shaped tube and has a thickness between 0.5 mm and 5 mm.
    17. Unmanned aerial vehicle (UAV), comprising:
    a body;
    a tube with a fin and a fluid, the fin located on top of the tube at a first location outside the body and the tube extends from the inside of the body to the outside of the body;
    a heat source fixed to the top of the tube in a
    Petition 870190054037, of 6/12/2019, p. 11/50
    [5]
    5/5 second location within the body, the space of the second location at a first distance from the first location;
    a propeller located directly above the fin;
    and a wick structure along an inner surface of the tube, the wick structure configured for
    to allow what fluid scroll in of the structure of wick and to allow what a vapor forms from the fluid to go out gives structure in wick towards a center of the tube. 18. UAV, according the claim 17, in
    that the wick structure is configured to cause the fluid to evaporate in the tube at the second location and form the vapor that moves towards the first location where the vapor condenses back into the fluid.
    19. UAV according to claim 18, wherein the wick structure is one between honeycomb, mesh, fiber or powder.
    20. UAV according to claim 17, wherein the body is hermetically sealed and the tube has a variable thickness along an axial direction with a variable thickness from 0.5 mm to 5 mm.
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    同族专利:
    公开号 | 公开日
    CA3043042A1|2018-06-28|
    WO2018118383A1|2018-06-28|
    US20180170553A1|2018-06-21|
    CN110087993A|2019-08-02|
    US20210129995A1|2021-05-06|
    KR20190097028A|2019-08-20|
    EP3558820A1|2019-10-30|
    JP2020515031A|2020-05-21|
    TW201827301A|2018-08-01|
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    法律状态:
    2021-10-13| B350| Update of information on the portal [chapter 15.35 patent gazette]|
    2021-12-07| B06W| Patent application suspended after preliminary examination (for patents with searches from other patent authorities) [chapter 6.23 patent gazette]|
    优先权:
    申请号 | 申请日 | 专利标题
    US15/385,136|US20180170553A1|2016-12-20|2016-12-20|Systems, methods, and apparatus for passive cooling of uavs|
    PCT/US2017/064208|WO2018118383A1|2016-12-20|2017-12-01|Systems, methods, and apparatus for passive cooling of uavs|
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